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3D-MID allows for the integration of mechanical and electrical functions in the molded part.
Main characteristics:
- three dimensional molded printed circuit boards as replacement of regular PCBs (shielding or transmitting elements)
- many design options
- suitable material: PES, PEI, LCP, PA46, PA66
Different production processes can be utilized: - two-component molding with metalizing
- hot stamping of electrical-conductive films
- back molding of films that carry the PCBs
- insert molding of pre-formed metal structures
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